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Surface mounting condition, Soldering pattern, Bestar electronics industry co.,ltd – BeStar SMT8585-03H03 LF User Manual

Page 5: 1transducer

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Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)

4.Surface Mounting Condition

Follwing soldering conditions are recommend;Refer to Fig.1

4-R

1.0

5

.0

2

.1

4-Solder Pads

2.1

2

.1

2.1

5.0

5.Soldering Pattern

6

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2

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Drawn by:

Rev.

www.be-star.com [email protected]

BESTAR ELECTRONICS INDUSTRY CO.,LTD

6

5

Date

Drawn

4

Approved by:

Checked by:

Note

3

2

Page:4 of 7

1

Transducer

Date:

SMT8585-03H03 LF

SMT8585-03H03 LF

DRG NO: BS/TET01.048C

T

e

m

p

e

ra

tu

re

[

]

min.110s

0

0

100

50

100

50

ramp up to
150℃

min.3k/s

250

time [s]

200

150

350

300

ramp down
from T(solid)
min.6k/s

min.300s

200

150

min.190 ℃

300

250

min.40s

T(solid)min.217

max.90s

max.260 ℃

max.255 ℃

Temperature profile for a lead-free reflow process

400

郭 敏

程久生

韩学慧

06/10/07

宋文娟

姜丽敏

06/05/07

02/06/03

B

A

C

06/10/07

韩学慧

Notice: All specification must be satisfied in this condition except SPL. SPL shall be 83dB or more.

In automated mounting of The SMD Sound Transducers on printed circuit boards,any bending,

expanding and pulling forces or shocks against the SMD Sound Transducers shall be kept to a
minimum to prevent them from electrical failures and mechanical damages of the devices.
Soldering(Reflow)
(1)Soldering of The SMD Sound Transducers shall conform to the soldering conditions in the individual
specifications.
(2)The SMD Sound Transducers are designed for"Reflow Soldering"
(3)In the reflow soldering,too high soldering temperatures and too large tempearture gradient such as
rapid heating or cooling may cause electrical failures and mechanical damages of the devices.