BeStar SMT8585-03H03 LF - Manual (Page 5)

Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
4.Surface Mounting Condition
Follwing soldering conditions are recommend;Refer to Fig.1
4-R
1.0
5
.0
2
.1
4-Solder Pads
2.1
2
.1
2.1 5.0
5.Soldering Pattern
6 5 4 3 2 1
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Drawn by:
Rev.
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BESTAR ELECTRONICS INDUSTRY CO.,LTD
6 5
Date Drawn
4
Approved by:
Checked by:
Note
3 2
Page:4 of 7
1
Transducer
Date:
SMT8585-03H03 LF
SMT8585-03H03 LF
DRG NO: BS/TET01.048C
T
e
m
p
e
ra
tu
re
[
℃
]
min.110s
0
0 100 50
100
50
ramp up to
150℃
min.3k/s
250
time [s]
200 150 350 300
ramp down
from T(solid)
min.6k/s
min.300s
200
150
min.190 ℃
300
250
min.40s T(solid)min.217 ℃
max.90s
max.260 ℃ max.255 ℃
Temperature profile for a lead-free reflow process
400
郭 敏
程久生
韩学慧
06/10/07
宋文娟
姜丽敏
06/05/07
02/06/03
B
A
C 06/10/07 韩学慧
Notice: All specification must be satisfied in this condition except SPL. SPL shall be 83dB or more.
In automated mounting of The SMD Sound Transducers on printed circuit boards,any bending,
expanding and pulling forces or shocks against the SMD Sound Transducers shall be kept to a
minimum to prevent them from electrical failures and mechanical damages of the devices.
Soldering(Reflow)
(1)Soldering of The SMD Sound Transducers shall conform to the soldering conditions in the individual
specifications.
(2)The SMD Sound Transducers are designed for"Reflow Soldering"
(3)In the reflow soldering,too high soldering temperatures and too large tempearture gradient such as
rapid heating or cooling may cause electrical failures and mechanical damages of the devices.