BeStar SMT8585-05H03 LF - Manual (Page 5)

In automated mounting of The SMD Sound Transducers on printed circuit boards,any bending,expanding and
pulling forces or shocks against the SMD Sound Transducers shall be kept minimum to preven them from
electrical failures and mechanical damages of the devices.
Soldering(Reflow)
(1)Solderings of The SMD Sound Transducers shall conform to the soldering conditions in the individual
specifications.
(2)The SMD Sound Transducers are designed for"Reflow Solderings"
(3)In the reflow solderings,too high soldering temperatures and too large tempearture gradient such as rapid
heating or cooling may cause electrical failures and mechanical damages of the devices.
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
4.Surface Mounting Condition
Follwing soldering conditions are recommend;Refer to Fig.1
4-R
1.0
5
.0
2
.1
4-Solder Pads
2.1
2
.1
2.1 5.0
6 5 4 3 2 1
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Drawn by:
Rev.
www.be-star.com [email protected]
6 5
Date Drawn
4
Approved by:
Checked by:
Note
3 2
Page:5 of 8
1
Transducer
Date:
SMT8585-05H03 LF
T
empe
ra
tu
re [
℃
]
min.110s
0
0 100 50
100
50
ramp up to
150
℃
min.3k/s
250
time [s]
200 150 350 300
ramp down
from T(solid)
min.6k/s
min.300s
200
150
min.190 ℃
300
250
min.40s T(solid)min.217 ℃
max.90s
max.260 ℃ max.255 ℃
Temperature profile for a lead-free reflow process
400
陶红仲
DRG NO: BS/TET01.568A
徐 波
魏奉玲
09/03/20
SMT8585-0 5H03 LF
魏奉玲 09/03/20 A
Notice: All specification must be satisfied in this condition except SPL. SPL shall be 83dB or more.
5.Soldering Pattern