BeStar SMT8585-3.6H04-09 LF - Manual (Page 5)

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Checked by:
A
BESTAR ELECTRONICS INDUSTRY CO.,LTD
6
REV. Date
www.be-star.com [email protected]
Note
5
Drawn
4
Approved by:
2 3 1
Page:05 of 08
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
B
C
D
Drawn by:
Date:
A
B
C
D
4.Surface Mounting Condition
Following soldering conditions are recommended; Refer to Fig.1
E
F
G
H
6 5 4 3 2 1
E
F
G
H
300
300 0
0
50 100
time [s]
200 150 250 350 400
max.90s
min.40s
T
e
m
p
e
ra
tu
re
[
℃
]
ramp up to
150 ℃
min.3k/s
50
150
100
min.110s
min.300s
min.190 ℃
200
250
T(solid)min.217 ℃
max.260 ℃
ramp down
from T(solid)
min.6k/s
max.255 ℃
Temperature profile for a lead-free reflow process
Transducer
SMT8585-3.6H04-09 LF
DRG NO: BS/TET01.554B
SMT8585-3.6H04-09 LF
魏奉玲 08/10/08 A
09/07/02
魏奉玲
徐 波
王文邦
Notice: All specification must be satisfied in this condition except SPL. SPL shall be 85dB or more.
魏奉玲 09/07/02 B change reel direction
In automated mounting of The SMD Sound Transducers on printed circuit boards, any
bending, expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept to a minimum to prevent them from electrical failures and mechanical damages of
the devices
Soldering(Reflow)
(1)Soldering of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for "Reflow Soldering" under the
recommended solder profile
(3)SMD Sound Transducers which during the reflow soldering process are exposed to too
high soldering temperatures and/or too large temperature gradient such as rapid heating or
cooling may lead to electrical failures and mechanical damages of the devices.