BeStar BSP1010-03H03 LF - Manual (Page 5)

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Trailer160-200
25.5
Drawn by:
Date:
Unit:mm
The cover film peel strength force 0.1-0.7N
The cover film peel speed 300mm/min .
33.5 Max
B
C
400-560 Leader
100
0
.5
13
0
.2
330 Max
Diameter
240~280
Empty
Cover Film
Components
D
Dimensions of reel
B
C
D
4.1 packing drawing
E
F
Dimensions of carrier tape
4. Tape on Reel Packing
3.10 Recommended Temp. Profile for Reflow Oven
G
E
F
G
BSP1010-03H03 LF
6
H
5 4 3
H
2 1
6
A
REV. Date
5
Drawn Note
www.be-star.com [email protected]
4 3
Checked by:
Approved by:
2 1
Page:5 of 7
Piezo Sounder
A
400
Temperature profile for a lead-free reflow process
max.255 ℃ max.260 ℃
max.90s
T(solid)min.217 ℃ max.40s
250
300
min.190 ℃
150
200
min.300s
ramp down
from T(solid)
min.6k/s
300 350 150 200
time [s]
250
ramp up to
150℃
min.3k/s
50
100
50 100 0
0
min.110s
T
e
m
pe
ra
tu
re
[
℃
]
B
A
B
16 0.1
Min. 1.5
24
0
.2
4.0 0.1
2.0 0.1 1.5 +0.1
-0.0
11
.5
±0
.1
1
.75
0
.1
max5
°
A-A
B-B
2
.7
0
.1
12
.5
0
.1
0.3 0.05
12.5 0.1
X.XX
010-
03 LF
ar
XX.XX
BSP1010
03H03 LF
Bestar
XX.XX
BSP1010-
03H03 LF
Bestar
XX.XX
BSP1010-
03H03 LF
Bestar
李红元
邱 俊
10/08/16
赵 峥
BSP1010-03H03 LF
DRG NO: BS/TEP01.778A
博 士 達
Notice: All specification must be satisfied
in this condition.
SPL: allowable deviation 5dB of the
initial value after testing