BeStar SMT1212-05H6.5F-04 LF - Manual (Page 5)

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Transducer A A
6
REV.
Date
www.be-star.com [email protected]
5
Drawn Note
3 4
Approved by:
2 1
Page:5 of 10
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
B
C
D
Date:
Drawn by:
Checked by:
B
C
D
4.Surface Mounting Condition
In automated mounting of The SMD Sound Transducers on printed circuit boards,any
bending,expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept minimum to preven them from electrical failures and mechanical damages of the
devices.
Soldering(Reflow)
(1)Solderings of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for"Reflow Solderings"
(3)In the reflow solderings,too high soldering temperatures and too large tempearture
gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
Follwing soldering conditions are recommend;Refer to Fig.1
E
F
G
H
E
F
G
H
6 5 4 3 2 1
SMT1212-05H6.5F-04 LF
min.40s
max.255 ℃
T(solid)min.217 ℃
max.260 ℃
300
250
min.300s
Temperature profile for a lead-free reflow process
max.90s
400 300 350
ramp down
from T(solid)
min.6k/s
250 150 200
time [s]
min.190 ℃
100
0
0 50
ramp up to
150℃
min.3k/s
T
emp
e
ra
tu
re
[
℃
]
200
100
150
50
min.110s
Notice: All specification must be satisfied in this condition except SPL. SPL shall be 88dB or more.
A 魏奉玲 09/07/02
09/07/02
魏奉玲
徐 波
陶红仲
DRG NO: BS/TET01.594A
SMT1212-05H6.5F-04 LF