BeStar BSP1212-03H03-01 LF - Manual (Page 5)

4. Tape on Reel Packing
330 Max
Diameter
25.5
13
0
.2
1
00
0
.5
33.5 Max
A
Page:5 of 7
B
C
D
E
F
G
H
Note REV.
A
Date Drawn
6 5
Date:
Approved by:
4 3
Checked by:
Drawn by:
2 1
Piezo Sounder
T
hi
s
p
rin
t
and
in
fo
rm
a
tion
t
he
re
in
a
re
p
rop
rie
ta
ry
t
o
B
e
s
ta
r
E
le
c
tr
oni
cs
I ndu
s tr
y C
o
.,
L
td.
and
s
hall
no
t
be
u
s
ed
in
w
hole
o
r
in
pa
rt
w
it
hou
t
its
w
ri
tt en
c
on
tent
B
C
D
E
F
G
H
6 5 1 3 2 4
4.1 packing drawing
Dimensions of carrier tape
Dimensions of reel
The cover film peel strength force 0.1-0.7N
The cover film peel speed 300mm/min.
Components
Trailer160-200
240~280
Empty
Cover Film
400-560 Leader
Unit:mm
www.be-star.com [email protected]
BSP1212-03H03-01 LF
BSP1212-03H03-01 LF
12
.5
±0
.1
Min. Ø1.5
16 ±0.1
24
±
0
.2
0.3 ±0.05 B
11
.5
±0
.1 1.5 +0.1
0
1
.75
±0
.1
4 ±0.1
2 ±0.1
A A
B-B
B
3
.1
±
0
.1
12.5 ±0.1
max5
°
A-A xx.xx
Bestar
赵 峥
邱 俊
李红元
DRG NO: BS/TEP01.680B
10/09/02
200
0
0 100 50 150
100
T e m
pe
ra
tu
re
[
℃
]
50
150
ramp up to
150℃
min.3k/s
min.110s
min.190 ℃
250 200
time [s]
300 400 350
ramp down
from T(solid)
min.6k/s
max.90s
3.9 Recommended Temp. Profile for Reflow Oven
Temperature profile for a lead-free reflow process
T(solid)min.217 ℃
300
250
min.300s
max.260 ℃
min.40s
max.255 ℃
博 士 達