BeStar BSP1212-03H2.5B-01 LF - Manual (Page 4)

Date:
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BESTAR ELECTRONICS INDUSTRY CO.,LTD
Checked by:
Approved by:
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3. Reliability test
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Piezo Sounder
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3.6 Drop test
Height 70cm
(to 10mm thickness woodenboard)
Direction 3
3.7 Solderability
The part lead pins shall be immersed in molten solder maintained at 255 5 C for
a period of 3 0.5 seconds.
After the test ,95% coverage with a continuous coating of bright solder
3.8 Solder Heat Resistance
The part lead pins shall be immersed in molten solder maintained at 255 10 C for
a period of 30seconds
After the test, the part shall meet the specification without any degradation in appearance and
performance
Notice: All specification must be satisfied in this condition.
SPL: allowable deviation 4dB of the initial value after testing
30min
3.1 high temperature test
Temperature +85 C
Duration 96hrs
3.2 low temperature test
Temperature -40 C
Duration 96hrs
3.3 life test in normal temperature
Power supply rated voltage
Duration 1000hrs
3.4 temperature cycle test
all these tests above should be measured after leaving normal temperature for 2hrs.
Cycles 5
3.5 Humidity test
Temperature +40 C
Relative Humidity 93%
Duration 96hrs
30min
+20 C
15min
-20 C
+70 C
15min
+20 C
90 3s
10 1s
245 5 C
260max
30 10s
217 C
3.9 Recommended Temp. Profile for Reflow Oven
150 10 C
A
BSP1212-03H2.5B-01 LF
08/04/03 赵 峥
08/04/03
赵 峥
李红元
张秀琴
BSP1212-03H2.5B-01 LF
DRG NO: BS/TEP01.580A