BeStar SMT1212-05XH10 LF - Manual (Page 5)

C C
Transducer A A
Checked by:
BESTAR ELECTRONICS INDUSTRY CO.,LTD
Approved by: REV.
6 5 4
Drawn Date Note
3 2
www.be-star.com [email protected]
1
Page:4 of 7
time [s]
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
Date:
Drawn by:
B B
In automated mounting of The SMD Sound Transducers on printed circuit boards,any
bending,expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept minimum to preven them from electrical failures and mechanical damages of the
devices.
Soldering(Reflow)
(1)Solderings of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for"Reflow Solderings"
(3)In the reflow solderings,too high soldering temperatures and too large tempearture
gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
G G
min.300s
T
h
is
p
ri
n
t
and i
n
fo
rm
at
io
n
t
h
e
re
i
n
a
re
p
ro
p
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e
tary
t
o
B
e
s
tar
El
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c
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onic
s
I
ndus
tr
y
C
o
.,
Lt
d
.
an
d s
h
al
l
no
t be
u
s
e
d
i
n
w
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le
o
r
in
p
a
rt
w
it
h
ou
t i
ts
w
ri
tt
e
n
c
o
n
te
n
t
T(solid)min.217 ℃
T
e
m
perat
u
re
[
℃
]
50
50
0
0 100 150
ramp up to
150℃
min.3k/s
100
min.110s
D
200
min.190℃
150
250
ramp down
from T(solid)
min.6k/s
250 200 300 350 400
max.90s
min.40s
max.260℃ max.255℃
D
Temperature profile for a lead-free reflow process
Follwing soldering conditions are recommend;Refer to Fig.1
F
E 300
F
E
4.Surface Mounting Condition
H
6 5 4
SMT1212-05XH10 LF
3 2 1
H
B
A
07/11/16
01/07/04 王善梅
魏奉玲
07/11/16
魏奉玲
陶红仲
张秀琴
SMT1212-05XH10 LF
BS/TET01.047B