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2v cmos interface characteristics, Mdio bidirectional interface characteristics, Xaui driver characteristics – Approved Optics Approved JUNIPER XENPAK-1XGE-LR User Manual

Page 3: Xenpak-1xge-lr-a

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XENPAK-1XGE-LR-A

XENPAK-LR 10GB Module
1310nm, 10K, SMF, SC RoHS6

XAUI Driver Characteristics

Parameter

Symbol

Min.

Typ.

Max.

Unit

Baud Rate

-

3.125

-

Gbit/s

Baud Rate Tolerance

-100

-

+100

ppm

Differential Amplitude

800

-

1600

mVPP

1.2V CMOS Interface Characteristics

Parameter

Symbol

Min.

Typ.

Max.

Unit

Baud Rate

-

3.125

-

Gbit/s

Baud Rate Tolerance

-100

-

+100

ppm

Differential Amplitude

200

-

1600

mVpp

Input High Voltage

VIH

0.84

-

1.5

V

Input Low Voltage

VIL

-0.3

-

0.36

V

Input Pull-down Current

IIn

20

40

120

μA

Output High Voltage

VOH

1.0

-

-

V

Output Low Voltage

VOL

-

-

0.2

V

Pull up Resistance

RLASI

10

-

22

k ohm

Capacitance

CLASI

-

-

10

pF

Load Capacitance

CLoad

-

-

320

pF

MDIO Bidirectional Interface Characteristics

Parameter

Symbol

Min.

Typ.

Max.

Unit

Input High Voltage

VIHM

0.84

-

1.5

V

Input Low Voltage

VILM

-0.3

-

0.36

V

Output High Voltage

VOHM

1.0

-

1.5

V

Output Low Voltage

VOLM

-0.3

-

0.2

V

Pull up Resistance

RMDIO

200

-

Note 1

Ohm

MDC min high/low time

THM,TLM

160

-

-

ns

MDC Frequency

1/TCK

TBD

-

2.5

MHz

Setup time

TDIS

10

-

-

ns

Hold time

TDIH

10

-

-

ns