Rainbow Electronics APExx24 - Manual (Page 7)

APExx24 Series
Rev 1.5 2004/4/20 6
6.2 Bonding Diagram of
APE25524 / APE34024
Pad # Pad Name X Y Pad # Pad Name X Y
1 GND4 75 404 18 GND1 2033 4525
2 GND3 58 293 19 PRC1 1920 4525
3 PWM1 56 145 20 PRC2 1807 4525
4 Vdd3 183 60 21 PRC3 1694 4525
5 PWM2/Cout 467 58 22 PRD0 1581 4525
6 Vdd2 988 86 23 PRD1 1468 4525
7 OSC1 1106 86 24 PRD2 1355 4525
8 PRB0/OSC2 1224 86 25 PRD3 1242 4525
9 PRB1/IR 1342 86 26 PRE0 1129 4525
10 PRB2 1460 86 27 PRE1 1016 4525
11 PRB3/Reset 1578 86 28 PRE2 903 4525
12 PRA0 1696 86 29 PRE3 790 4525
13 PRA1 1814 86 30 PRF0 676 4525
14 PRA2 1932 86 31 PRF1 563 4525
15 PRA3 2050 86 32 PRF2 450 4525
16 PRC0 2168 86 33 PRF3 337 4525
17 GND2 2160 230 34 Vdd1 223 4525
ROM
PRD1
2
5
6 7 8 9 10 13 11 12 14 15 16
17
21
PRE0
OSC1 Vdd2
GND2
PRB2 PRB1 PRB0 PRB3 PRA3 PRA2 PRA1 PRA0
GND3
PWM2/Cout
GND4
1
Chip Size : 2330 um x 4694 um
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
3
4
PWM1
Vdd3
19 20
PRD2 PRD3
(0,0)
28 27 26 25 24 23 22 18 33 32 31 30 29 34
PRC0
GND1 PRD0 PRE1 PRC3 PRC2 PRC1 Vdd1 PRF3 PRF2 PRF1 PRF0 PRE3 PRE2
X
Y