Interlink Electronics MicroModule PS2 - Manual (Page 2)

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PS2 MicroModule
Integration Guide
Table of Contents
1.0
Introduction.................................................................................................................... 1
2.0 Scope ................................................................................................................................ 1
3.0 Theory of Operation .................................................................................................... 2
4.0 Features and Operation ............................................................................................. 4
4.1 Using the Pressure-Sensing Actuator ................................................................... 4
4.2 Clicking and Dragging ........................................................................................... 4
5.0 Mounting .......................................................................................................................... 5
5.1 Suggested Panel Cut-out ...................................................................................... 5
5.2 Mounting MicroModule .......................................................................................... 6
5.3 Supporting MicroModule’s PCB ............................................................................ 7
5.4 Sealing MicroModule with Silicone Sealant........................................................... 7
6.0 Connection ..................................................................................................................... 8
6.1 Molex Header/Mating Connector Specifications ................................................... 8
6.2 PS/2 Interface Connections ................................................................................... 9
6.3 Cable Options ...................................................................................................... 10
7.0 PS/2 Information ......................................................................................................... 11
7.1 Data Packet ......................................................................................................... 11
7.2 Operating Voltage and Current ........................................................................... 12
8.0 Drawings and Dimensions ....................................................................................... 13
9.0 Orderable Part Numbers .......................................................................................... 15
10.0 Intellectual Property & Other Legal Matters .................................................... 15
11.0 Contact Interlink Electronics ................................................................................ 16