Lucent Technologies APX 1000 - Manual (Page 3)

APX
®
1000 Universal Gateway
Hardware Technical Specifications
8. Physical Dimensions
14.8” (D) x 17.2” (W) x 5.20” (H) (3 rack units) 3RU
Loaded system weight: 39 lbs. (approximate)
9. Chassis Architecture
6 slots total
1 dedicated slot for system controller module
1 dedicated slot for channel ingress card
4 general purpose slots for port processing, circuit and
packet modules
10. Universal Port Density
576 voice/data calls – via Channelized T1
672 voice/data calls – via Channelized DS3
720 voice/data calls – via Channelized E1
11. Serviceability/Redundancy
Packet, circuit and processing modules hot-swappable
All modules and fan tray field-replaceable
Three (3) independent cooling fans with system
monitored fan-fail signals removable fan tray
AC and DC power supply units
- Hot-swappable, 1+1 redundant, load sharing, AC
input and DC input power supplies
- Mixed AC & DC supplies supported in the same
chassis
12. APX
®
1000 Universal Gateway Module Options
WAN Access Modules
Circuit switching (ingress)
– 24-port Channelized T1/E1
– 8-port Channelized E1
– 8-port Channelized T1
– 1-port Channelized DS3
Packet switching (egress)
– 1-port OC3/STM-1 ATM (copper or short-haul fiber or
long-haul fiber)
– 2- and 4-port 10/100 fast Ethernet
Processor Modules/CODEC Support
288-port MultiDSP / G.711, G.729 (a and b), G.723.1
240-port MultiDSP / G.711, G.729 (a and b), G.723.1
96-port MultiDSP / G.711, G.729 (a and b)
2nd- generation HDLC
13. Power Requirements
Power budget AC
Total typical values per fully loaded chassis:
Input power per chassis: 381 W
Heat dissipation: 959 BTU/h
Current intake @ 100Vac input: 9.6 A*
Current intake @ 115Vac input: 7.0 A*
Current intake @ 230Vac input: 3.5 A*
Recommendations:
Input power per chassis: 337 W
Heat dissipation: 1150 BTU/h
Current intake @ 100Vac Input: 9.6 A*
Current intake @ 115Vac Input: 8.5 A*
Current intake @ 230Vac Input: 4.2 A*
Power budget DC
Total typical values per fully loaded chassis:
Input power per chassis: 301 W
Heat dissipation: 1027 BTU/h
Current intake @ -48Vdc input: 16.0 A*
Current intake @ -40Vdc input: 20.0 A*
Recommendations:
Input power per chassis: 361 W
Heat dissipation: 1233 BTU/h
Current intake @ -48Vdc input: 20.0 A*
Current intake @ -40Vdc input: 24.0 A*
Configuration:
1 x controller module, 3 x 288-port MultiDSP modules,
1 x DS3,
1 x Ethernet, 1 fan tray
* Per power supply
14. Operating Characteristics
Ambient operating temperature:
-0 C to 40 C (-5c to +55c for short term per GR63-
CORE)
Ambient storage temperature:
-40 C to +65 C
Relative humidity:
10% to 95% non-condensing
Operating altitude:
to 10,000 feet (3,050 M)
15. Regulatory Compliance
NEBS: Level 3 compliant, GR-63-CORE, GR-1089-
CORE, CLEI coded, available in TIRKS database
EMC/EMI: FCC 15 Class A, R&TTE Directive (EN
55022, EN 300 386), Class A, EN 61000-3-2, EN
61000-3-3, AS/NZS 3548, Class A, CISPR 22 Class A,
VCCI Class A, CNS 13438 Class A
Safety: CSA NRTL (UL 1950, Third Edition), CSA
C22.2, No. 950, Third Edition, R&TTE Directive EN
60950 Including Amendments 1, 2, 3, 4, 11, IEC
60950 including Amendments 1, 2, 3, 4
Telecom: FCC Part 68, IC CS 03, JATE