Diodes DMP4025LSD - Manual (Page 2)

DMP4025LSD
Document Number: DS35937 Rev: 2 - 2
2 of 8
www.diodes.com
April 2013
© Diodes Incorporated
ADVAN
CE I
N
F
O
RM
ATI
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A Product Line of
Diodes Incorporated
DMP4025LSD
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
-40
V
Gate-Source Voltage V
GSS
20
Continuous Drain Current V
GS
= -10V
(Notes 7 & 9)
I
D
-7.6
A
T
A
= +70°C (Notes 7 & 9) -6.1
(Notes 6 & 9) -5.8
(Notes 6 & 10) -6.9
Pulsed Drain Current V
GS
= -10V (Notes 8 & 9) I
DM
-28.0
Continuous Source Current (Body diode) (Notes 7 & 9) I
S
-3.0
Pulsed Source Current (Body diode) (Notes 8 & 9) I
SM
-28.0
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Power Dissipation
Linear Derating Factor
(Notes 6 & 9)
P
D
1.25
10
W
mW/°C
(Notes 6 & 10)
1.8
14.3
(Notes 7 & 9)
2.14
17.2
Thermal Resistance, Junction to Ambient
(Notes 6 & 9)
R
θJA
100
°C/W
(Notes 6 & 10) 70
(Notes 7 & 9) 58
Thermal Resistance, Junction to Lead (Notes 9 & 11) R
θJL
51
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Notes: 6. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
7. Same as note (2), except the device is measured at t  10 sec.
8. Same as note (2), except the device is pulsed with D = 0.02 and pulse width 300µs.
9. For a dual device with one active die.
10. For a device with two active die running at equal power.
11. Thermal resistance from junction to solder-point (at the end of the drain lead).