Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMN31D5UFZ User Manual
Page 2
DMN31D5UFZ
Document number: DS36843 Rev. 2 - 2
2 of 6
June 2014
© Diodes Incorporated
DMN31D5UFZ
NEW PROD
UC
T
ADVANCED INFORMATION
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
30 V
Gate-Source Voltage
V
GSS
±12 V
Continuous Drain Current (Note 5)
Steady
State
T
A
= +25°C
T
A
= +85°C
I
D
220
150
mA
Pulsed Drain Current (Note 6)
I
DM
500 mA
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
Steady state
P
D
393 mW
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
R
θJA
318 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
30
—
— V
V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current @T
C
= +25°C
I
DSS
— — 100 nA
V
DS
= 24V, V
GS
= 0V
Gate-Source Leakage
I
GSS
— — ±10
μA
V
GS
= ±10V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.4 — 1.0 V
V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance
R
DS(ON)
— — 1.5
Ω
V
GS
= 4.5V, I
D
= 100mA
— — 2.0
V
GS
= 2.5V, I
D
= 50mA
— — 3.0
V
GS
= 1.8V, I
D
= 20mA
— — 4.5
V
GS
= 1.5V, I
D
= 10mA
— 2.8 —
V
GS
= 1.2V, I
D
= 1mA
Diode Forward Voltage
V
SD
— 0.75 1.0 V
V
GS
= 0V, I
S
= 10mA
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
— 22.2 — pF
V
DS
= 15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
—
2.9
—
pF
Reverse Transfer Capacitance
C
rss
—
2.2
—
pF
Total Gate Charge
Q
g
—
0.35
—
nC
V
GS
= 4.5V, V
DS
= 15V,
I
D
= 200mA
Gate-Source Charge
Q
gs
—
0.05
—
nC
Gate-Drain Charge
Q
gd
—
0.02
—
nC
Turn-On Delay Time
t
D(on)
—
3.1
—
ns
V
DD
= 10V, V
GS
= 4.5V,
R
G
= 6Ω, I
D
= 200mA
Turn-On Rise Time
t
r
—
2.0
—
ns
Turn-Off Delay Time
t
D(off)
—
20
—
ns
Turn-Off Fall Time
t
f
—
6.9
—
ns
Notes:
5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.