Recommended operating conditions, Electrical characteristics, Pin microprocessor reset circuits – Diodes APX809/810 User Manual
Page 3

APX809/810
3-PIN MICROPROCESSOR RESET CIRCUITS
APX809/810 Rev. 4
3 of 9
FEBRUARY 2009
©
Diodes Incorporated
Recommended Operating Conditions
Symbol
Parameter
Min
Max
Unit
V
CC
Supply
Voltage
1.1
5.5
V
V
IN
Input
Voltage
0
(V
CC
+0.3) V
T
A
Operating Ambient Temperature Range
-40
85
o
C
T
R
Vcc Rising Time (Vcc = 0~VT)
100
V/ uS
Electrical Characteristics
(T
A
= 25ºC)
T
A
= -40 to 85
o
C unless otherwise note. Typical values are at T
A
=+25
o
C.
Symbol
Parameter
Test Conditions
Min
Typ.
Max
Unit
V
CC
V
CC
Range T
A
= 0
o
C to +70
o
C 1.0
5.5
V
I
CC
Supply
Current
V
TH
+ 0.2V
30
40
μA
V
TH
Reset
Threshold
APX809/810-23
T
A
= 0
o
C-85
o
C
2.21 2.25 2.30
V
APX809/810-26 2.59
2.63
2.69
APX809/810-29 2.88
2.93
3.00
APX809/810-31 3.02
3.08
3.15
APX809/810-40 3.93
4.00
4.08
APX809/810-44 4.31
4.38
4.47
APX809/810-46 4.56
4.63
4.72
APX809/810-23
T
A
= -40
o
C-85
o
C
2.20 2.25 2.30
V
APX809/810-26 2.57
2.63
2.69
APX809/810-29 2.86
2.93
3.00
APX809/810-31 3.00
3.08
3.15
APX809/810-40 3.92
4.00
4.08
APX809/810-44 4.29
4.38
4.47
APX809/810-46 4.54
4.63
4.72
Reset Threshold Tempco
30
ppm/
o
C
T
S
Set-up
Time
V
CC
= V
TH
to (V
TH
– 100mV)
20
μs
T
DELAY
Reset Active Timeout Period T
A
= 0
o
C to +85
o
C 140
200
280
ms
V
OL
T
RESE
Output Voltage Low
(APX809)
V
CC
= V
TH
-0.2, I
SINK
= 1.2mA
0.3
V
V
CC
= V
TH
-0.2, I
SINK
= 3.2mA
0.4
V
CC
> 1.0V, I
SINK
= 50uA
0.3
V
OH
T
RESE Output Voltage-High
(APX809)
V
CC
> V
TH
+0.2,
I
SOURCE
= 500uA
0.8V
CC
V
V
CC
> V
TH
+0.2,
I
SOURCE
= 800uA
V
CC
–1.5
V
OL
RESET Output Voltage-Low
(APX810)
V
CC
= V
TH
+0.2, I
SINK
= 1.2mA
0.3
V
V
CC
= V
TH
+0.2, I
SINK
= 3.2mA
0.4
V
OH
RESET Output Voltage-High
(APX810)
1.8V < V
CC
< V
TH
-0.2,
I
SOURCE
= 150uA
0.8 V
CC
V
θ
JA
Thermal Resistance
Junction-to-Ambient
SOT23/SOT23R (Note 3)
201
o
C/W
θ
JC
Thermal Resistance
Junction-to-Case
SOT23/SOT23R (Note 3)
56
o
C/W
Notes: 3. Test condition for SOT23/ SOT23R: Devices mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.